Technicure® Nano Dicy

1 of 3 products in this brand
Technicure® Nano Dicy is a pulverized grade of dicyandiamide. It contains fumed silica to prevent clumping and enhance flow. Its extremely fine particle size enables a more complete reaction, facilitating faster curing without compromising formulation shelf stability.

Chemical Family: Guanidines, Silica

Labeling Claims: Not Listed In California Proposition 65

Compatible Polymers & Resins: Epoxies (EP)

Features: Excellent Adhesion, Fast Cure, Fast Curing, Good Adhesion, High Glass Transition Temperature, Improves Flow, Long Shelf Life, Low Temperature Performance, Multi-Substrate Adhesion, Prevents Clumping

End Uses: 1K (1 Component) Adhesive, Powder Coating, Pre-pregs

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Enhanced TDS

Identification & Functionality

Features & Benefits

Labeling Claims
CASE Ingredients Features
Materials Features
Product Benefits
  • Long formulation shelf stability
  • High glass transition temperature
  • Excellent adhesion to a variety of substrates
  • Can be used with an accelerator

Applications & Uses

Markets
Applications
Compatible Polymers & Resins
Adhesive & Sealant End Applications
Coating End Applications
Composites End Use
Use Level
3 - 8 phr (Epoxy resin (EEW=190))
Product Applications
  • One-component adhesives for auto, aerospace and electronics applications
  • Composites such as pre-pregs
  • Powder coatings
  • Technicure® Nano-Dicy can be used with accelerators to lower temperature of initiation.

Properties

Physical Form
Appearance
White micronized powder
Typical Properties
ValueUnitsTest Method / Conditions
Average Particle Size1 - 2micron-
Average Particle Size (90%)max. 5micron-
Melting Point207 - 211°C-
Assay Content99.0%-
Moisture Contentmax. 0.5%-

Regulatory & Compliance