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Technicure® Nano Dicy
Chemical Family:
Silica, Guanidines
Labeling Claims:
Not Listed In California Proposition 65
Compatible Polymers & Resins:
Epoxies (EP)
Features:
Prevents Clumping, High Glass Transition Temperature, Fast Cure, Good Adhesion, Long Shelf Life, Excellent Adhesion, Low Temperature Performance, Improves Flow, Multi-Substrate Adhesion, Fast Curing
End Uses:
Pre-pregs, 1K (1 Component) Adhesive, Powder Coating
Technicure® Nano Dicy is a pulverized grade of dicyandiamide. It contains fumed silica to prevent clumping and enhance flow. Its extremely fine particle size enables a more complete reaction, facilitating faster curing without compromising formulation shelf stability.
EM Sullivan
Technicure® D44
Chemical Family:
Amides
Compatible Polymers & Resins:
Epoxies (EP)
Technicure® D44 is a crystalline epoxy curing agent. It is white with a slight odor.
EM Sullivan
Technicure® MDU-11M
Chemical Family:
Urea & Urea Derivatives
Compatible Polymers & Resins:
Epoxies (EP)
Technicure® MDU-11M is a substituted urea commonly utilized as a dicyandiamide accelerator in one-component epoxy resin-based formulations.