Hauthane L-2183 is an anionic, aliphatic waterborne polyurethane dispersion.

Chemical Family: Anionics, Polyurethanes (PU)

End Uses: Pressure Sensitive Adhesive, Waterborne Adhesive, Waterborne Coating

Features: Heat Resistance, High Bond Strength, Low Activation Temperature, Non-Crystalline

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Identification & Functionality

Features & Benefits

CASE Ingredients Features
Product Features
  • Low activation temperature (200°F)
  • Can be crosslinked to improve bond strength and heat-resistance.
  • Non-crystalline nature
  • Contains n-methyl pyrrolidone co-solvent.

Applications & Uses

Markets
Applications
Application Method
Compatible Polymers & Resins
Adhesive & Sealant End Applications
Coating End Applications
Suggested Uses
  • Hauthane L-2183 is an adhesive grade polyurethane suggested for modifying industrial laminating adhesives.
  • Hauthane L-2183 may also be used in low tack pressure sensitive applications.
Product Applications
  • Hauthane L-2183 can be used as supplied or blended with vinyl acetate/ethylene, styrene butadiene and acrylic emulsions.
  • The rheology of Hauthane L-2183 may be modified with associative or acrylic thickeners for knife-over-roll or similar methods.

Properties

Physical Form
Physical Properties
ValueUnitsTest Method / Conditions
Solid Content34 - 36%-
Brookfield Viscosity (RVT, sp. 3, 100 rpm)50 - 500cPs-
pH Value 7.0 - 9.5--
Density8.6lbs/gal-
Volatile Organic Compound (as supplied)47.0gm/l-
Softening Point200.0°F
Tensile Properties
ValueUnitsTest Method / Conditions
Elongation (Tested at 20 Inches/minute)1200.0%-
Tensile Strengh (Tested at 20 Inches/minute)1500.0psi-
100% Modulus (Tested at 20 Inches/minute)75.0psi-
200% Modulus (Tested at 20 Inches/minute)85.0psi-
300% Modulus (Tested at 20 Inches/minute)100.0psi-

Regulatory & Compliance

Chemical Inventories

Technical Details & Test Data

Drying/Curing

Hauthane L-2183 may be crosslinked with carbodiimides, polyaziridines, water dispersible polyisocyanates, epoxy silanes or low temperature curing melamines to increase bond strength and heat resistance.